Overview
This is a Sn-Bi solder ball that is compatible with low -temperature reflow mounting (Peak temperature of 160-180 °C ) .
Sn42Bi58 and Sn42Bi57Ag1 can avoid the traditional reflow profile exceeding 200°C
The number of applications is increasing due to the total balance including mechanical properties.
Advantages
- Reduced warpage of boards and packages
- Improving yield of thin devices
- Energy cost reduction
- Supports heat-sensitive materials (resin, optical components)
Types, Characteristics, and Applications
| Alloy system | Melting point | Features | Applications |
|---|---|---|---|
| Sn-58Bi | Approximately 138°C | The most common low-temperature type. Good wettability.Fragility to be an issue. | BGA, CSP, Thin devices |
| Sn-Bi-Ag(Ag added) | 140 – 150°C | Improved Bi-based brittleness and improved drop resistance. | Mobile, Automotives |